HY268 8.0W/m·K Thermal Putty (100g Tub) for GPU, ASIC & High-Power Electronics s19i Engineered for high heat flux

Engineered for high heat flux applications: blends silicone

A: For stock Goldshell firmware

Air-cooled M50 returning from storage — original paste likely degraded

Parameter Specification Item Tin Tool Fixture with Holder + Stencil Plate Compatible Chips A3201SKV3

Engineered for the L7 cooling layout

HY268 8.0W/m·K Thermal Putty (100g Tub) for GPU, ASIC & High-Power Electronics s19i Engineered for high heat fluxHY268 8 W mK Premium Thermal Putty 100g for GPU & ASIC Miners The HY268 Thermal Putty is a premium thermal interface material engineered for high power electronics, ASIC miners, GPU memory, SSDs, and compact thermal gaps. With 8. 0 W mK thermal conductivity and ultra low 0. 021 Cin W thermal impedance, HY268 delivers stable and efficient heat transfer where traditional thermal pads are limited. Unlike fixed thickness thermal pads, HY268 thermal putty